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展會(huì)概況

2017年1月日本電子元器件及電子材料展日期： 2017年1月18日(星期三)－20日(星期五）會(huì)場(chǎng)：日本東京有明國(guó)際展覽中心 JAPAN 主辦單位： Reed Exhibitions Japan Ltd. 展會(huì)名稱(chēng)： NEPCON JAPAN 2017 – 46th Electronics R&D and Manufacturing Technology Expo 中國(guó)區(qū)域代理：Guangzhou Li zhiying Exhibition Service Co.,Ltd. 廣州勵(lì)智穎展覽服務(wù)有限公司聯(lián)系人：郭靜/Lily bbb: 86-20-66658596 Mobile phone：18319698199 E-Mail:expo_lily@163.com QQ/微信:448755889 同期活動(dòng)：技術(shù)研討會(huì) NEPCON JAPAN 2017 – 46th Electronics R&D and Manufacturing Technology Expo 內(nèi)含展會(huì) 46th INTERNEPCON JAPAN 34th ELECTROTEST JAPAN 18th IC PACKAGING TECHNOLOGY EXPO 18th ELECTRONIC COMPONENTS & MATERIALS EXPO PWB EXPO–18th Printed Wiring Boards Expo 7th FINE PROCESS TECHNOLOGY EXPO NEPCON JAPAN 2017 – 46th Electronics R&D and Manufacturing Technology Expo 同期展會(huì) 3rd WEARABLE EXPO - Wearable Device & Technology Expo AUTOMOTIVE WORLD 2017 9th Light-Tech Expo - Int'l Exhibition for LED/OLED Technology & Application - RoboDEX - 1st Robot Development & Application Expo What is NEPCON JAPAN? Asia's Leading Exhibition for Electronics Design, R&D and Manufacturing Launched in 1972, NEPCON JAPAN has grown as an "Electronics Packaging & Production Show" together with the Japanese electronics industry. Adding IC Packaging, PCB and electronic components in 2000, the show has increased its value as an "International Exhibition for Electronics R&D, Design and Manufacturing". Furthermore, adding exhibitions for promising applications such as Automotive Electronics, Electric Vehicles, LED/OLED Lighting and Wearable device, NEPCON JAPAN attracts attention as a venue to see the latest technologies for "Future of Electronics". Due to the recent growth in the number of exhibitors and visitors from China, Korea and Taiwan, the show has grown as an "Exhibition Representing the Asian Electronics Industry". 什么是NEPCON JAPAN？亞洲領(lǐng)先的電子設(shè)計(jì)、研發(fā)與制造技術(shù)展覽會(huì)。作為“電子封裝&制造”的綜合展會(huì)，自1972年舉辦至今，NEPCON JAPAN隨著日本電子行業(yè)的發(fā)展也在不斷的成長(zhǎng)壯大。

參展范圍

6th NEPCON JAPAN是世界領(lǐng)先的電子設(shè)計(jì)、研發(fā)與制造技術(shù)展覽會(huì)。每年展會(huì)上都會(huì)展示眾多電子制造業(yè)的創(chuàng)新成果。NEPCON JAPAN由6個(gè)專(zhuān)業(yè)展會(huì)以及技術(shù)會(huì)議組成，涉及領(lǐng)域包括SMT,IC封裝，PCB/PWB,測(cè)量/分析，電子元件/材料，精密加工。

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2017年NEPCON JAPAN日本電子元器件展覽會(huì)

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